{"product_id":"instrument-bga-relife-tx3","title":"Instrument BGA Relife TX3","description":"\u003cdiv class=\"text-editor-custom-title\"\u003eInstrument BGA Relife TX3\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eProfesionalni precizni instrument Relife TX3 posebno je dizajniran za GSM servisne tehničare i mikroelektroničke laboratorije, \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003epružajući milimetarsku kontrolu u delikatnim postupcima odvajanja i vađenja integriranih komponenti s matičnih ploča. \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eS kalibriranom geometrijom za mikro-intervencije, alat je idealan za sigurno podizanje BGA čipova, procesora (CPU),\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e memorija NAND\/pohrane i drugih integriranih krugova, sprječavajući lomljenje kontaktnih podloga. Drška izrađena od odabranog čelika visoke čvrstoće\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e osigurava superiornu otpornost na habanje, deformaciju i visoke temperature, dok fini, polirani i precizno završeni vrh,\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e lako klizi ispod komponenti bez grebanja krugova, kositrene maske ili finih tragova PCB-a.\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cimg src=\"https:\/\/img.gsmnet.ro\/800X800\/products\/248309\/instrument-bga-relife-tx3-4-1791530575.jpg\" title=\"instrument-bga-relife-tx3-\" alt=\"instrument-bga-relife-tx3-\" class=\"text-editor-custom-img text-editor-custom-img-for-split\" style=\"width: 50%;\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cb\u003eZnačajke:\u003c\/b\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Primjene: Podizanje i odvajanje procesora (CPU), memorija za pohranu (NAND\/eMMC), napajanje čipova i BGA krugova\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Zaštita PCB-a: Fino polirani i glatki vrh, dizajniran za sprječavanje grebanja tragova i oštećenja podloga\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Materijal drške: Odabrani čelik visoke kvalitete, s visokom tvrdoćom i otpornošću na mehaničko habanje\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Termička i mehanička kontrola: Visoka razina čvrstoće, otporan na izravnu upotrebu u blizini lemilice ili mlaza toplog zraka\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Ciljani korisnici: Servisni tehničari za telefone\/laptopove, GSM radionice i stručnjaci za mikro-lemljenje i reballing\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003c\/div\u003e","brand":"Relife","offers":[{"title":"Default Title","offer_id":59107332129100,"sku":"386418","price":5.8,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0833\/9102\/1388\/files\/instrument-bga-relife-tx3-2-1791530575.jpg?v=1791530938","url":"https:\/\/gsmnet.hr\/products\/instrument-bga-relife-tx3","provider":"GSMnet","version":"1.0","type":"link"}